有限元电磁场仿真-ANSYS Electromagnetics Suite-2020R2-英文-[Windows]
HFSS 2020 R2
软件介绍
独家专业软件，Windows/Linux/macOS全平台*，安装破解教程齐全！*
有限元电磁场仿真-ANSYS Electromagnetics Suite-2020R2-英文-[Windows]
HFSS 2020 R2
What\s New in ANSYS Electronics Desktop 2020 R2
General Electronics Desktop l New loopback address option to improve reliability of local solves when connecting and disconnecting with VPN l Support for Microsoft MPI l Official release of Dynamic Surface Resolution meshing l Ability to export field overlay plots to Ensight l Improved workflows for mesh links between designs l Support for lighting of field overlay plots l New object-oriented property scripting (Beta) l Granta Producers Materials Data library now includes: l Common Rogers laminates with frequency-dependent models l Materials with temperature-dependent properties l Ability to search materials in Granta libraries using keyword
HFSS l 3D Component Antenna Array: Direct Matrix Solver Option l 5G SAR standards toolkit l Multipaction solution: l Auto-breakdown level calculation l Charged particle visualization l Official release l Broadband HFSS Meshing: Maximum parallel frequencies setting l HFSS SBR+ Near field analysis and plot overlay l Series Resistance-Inductance-Capacitance (RLC) Element l New Molex Antenna 3D Component library l Complex material definitions for layered impedance boundary conditions l Support for circuit ports with domain solver l Dynamic scheduling of distributed discrete sweeps l Solver Improvements: l Improved mesh adaption for models with circuit ports l Improved performance of mixed precision distributed matrix l UV sine space periodic unit cell scanning (Beta) l Conductor-Dielectric contact between IE regions (Beta) HFSS 3D Layout l HFSS 3D Components: Native support l HFSS Auto-solution setup with Fast HFSS simulation mode l Broadband HFSS Meshing: Maximum parallel frequencies setting l GDS based designs: Improved workflow and capacity l Circuit element definitions via netlist or schematic l Dynamic scheduling of distributed discrete sweeps l Solver Improvements: l Improved mesh adaption for models with circuit ports l Improved performance of mixed precision distributed matrix l HFSS auto-extents improvement for enhanced performance l Point-based RLC circuit components
Maxwell l Temperature dependent core loss calculations l Distributed domain decomposition in 3D magnetostatic
l Harmonic force interpolation for improved ERP waterfall diagrams l Harmonic force export to third-party formats l Support for python control programs in 2D and 3D transient l Workflow improvements for RMxprt general machine type l Support for temperature feedback on impedance boundaries in 3D eddy l Improved partial mesh and simulation from full rotational model (Beta) l Electric machine toolkit enhancements new machine types l Support for Y connections in 3D transient l New ECE ROM model for induction machines l Shared memory multiprocessing in 2D transient l Support for GPU in distributed 3D eddy frequency sweeps l Option for user to override parameters in RMxprt l Enhancements to Maxwell 3D Transient solver based on A-Phi (Beta) l Ability to create efficiency maps in Maxwell from RMxprt results Icepak l Enhancements to meshing workflows reliability and efficiency l Ability to import external mesh on objects l Support for mechanical data and package models through 3D Layout l New concurrent meshing to distribute mesh regions l Support for rotated PCBs with EM loss coupling l Ability to import EXCML in Electronics Desktop l Support for non-uniform material properties l New PCB and Solar Calculator toolkits l Support for non-uniform save intervals in transient
Mechanical (Beta) l Improved data link between Mechanical and EM designs l Ability to map HTC from Icepak l Support for shell elements and EM Loss mapping on sheets l New frictionless plane and cylindrical support for modal l Enhanced EM Loss support including scaling and offset Q3D Extractor l Ability to plot fields on non-model objects for CG
Circuit l SPISim technology: l Included in Electronics Enterprise and SIwave licensing l IEEE 802.3bj and 802.3bs COM and USB compliance checking l IBIS-AMI model generation and inspection l Improved workflow for creating reports in the spectral domain l New damping algorithm for improved DC and transient convergence l Piecewise linear diode model for power electronics l Snapback diode model for ESD simulation l Type I II and III compensator models l Schematic support for PSPICE VSWITCH models l New script command to add dynamic links EMIT (Beta) l Significant workflow and usability improvements l Ability to save components to libraries Twin Builder Export and Deployment Enhancements l Easily validate digital twins with Ansys Twin Deployer l Generate images from deployed twins l Native support for Twin Builder solver on Linux l Export co-simulation FMU 2.0 (tool-coupling FMU) l Export Twin Builder model for Fluent l Simplified cross-platform (Linux) twin generation for Modelica models Modelica Enhancements l Improved behavior for Modelica connector and connection lines l Syntax check for Modelica models and libraries l Encryption/password protection for Modelica models l Modelica workflow enhancements l Linux support for add-on libraries Battery and EV Verticalization l New EV Powertrain library l Enhancements to Battery Wizard
Enhancements to ROM Builder and 3D Visualization l Support for vector data visualization l Visualize snapshot after import in Check tab l Visualize displacement field l Define cutting plane and zone selection l Improved Static Rom Builder selection algorithm l Support for export snapshots at outputs in Dynamic ROM Builder l Comparison of results with 3D visualization l Standalone ROM Point Viewer New ROM Types in Twin Builder l New Response Surface ROM Apps for Creating ROM l Dynamic ROM Builder: Fluent Mechanical l Static ROM Builder: Fluent Mechanical UI and Performance Enhancements l New Output & Traces dialog box for quick plotting l Parameter Selection dialog box for sub-sheets l Page Port copy-paste enhancements l SdbCtrl data access in scripts l Performance improvements for script execution l Support for Super Large FMU (>4GB) l Support for new Fluent file format (cas.h5) Crack 破解方法 破解文件在字幕区:
- Do not install ANSYS License Manager 2020R2! Uninstall (if exist) previous versions of ANSYS Electronics 2. Install ANSYS Electronics 2020 R2 Win64 When asked for licensing select “I have a new license file” > Next and browse to “ansyslmd.lic” in crack folder 3. Overwrite original (at setup by default C:\Program Files\AnsysEM) with cracked one 4. If you have environment variable ANSYSLIC_DIR make sure that it points to \Shared Files\Licensing (at setup by default C:\Program Files\AnsysEM\Shared Files\Licensing ) 5. REBOOT! 6. Enjoy 感谢ldlolev (Power User)的提醒，按照如下方法添加环境变量可以解决启动的问题
系统环境变量新建一个项ANSYS_EM_DONOT_PRELOAD_3DDRIVER_DLL，变量值设成1📁 文件列表/
├─📁 ANSYS Electronics Suite 2020 R2 (x64)/
│ ├─📄 Ansys.Electronics.2020.R2.Win64.iso
│ └─📄 Ansys.Electronics.MCAD.Translators.2020.R2.Win64.iso
└─📄 Crack.rar