有限元电磁场仿真-ANSYS Electromagnetics Suite-2021R1-英文-[Windows]
HFSS 2021 R1
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有限元电磁场仿真-ANSYS Electromagnetics Suite-2021R1-英文-[Windows]
HFSS 2021 R1
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What’s New in ANSYS Electronics 2021 R1
The What’s New document for ANSYS Electronics provides release information for the following:
General Electronics Desktop
Commercial release of Mechanical and EMIT design types
Ansys Cloud enhancements:
- Multi-step job submission
- Auto extraction of report data
- Improved robustness and useability
Ability to edit design settings in the Properties window
Enhanced Minerva integration including direct project access
Integration of optiSlang setup in Optimetrics (Beta Windows only)
New 3D modeler orientation gadget
Support for Linux SLURM schedulers
Automatic use of loopback address to improve reliability when connecting and disconnecting with VPN
Ability to schedule submit and monitor jobs in standalone utility
New menu command to validate parametric setups before solving
Enhanced useability and workflows in Network Data Explorer
Proxy 3D Components (Beta)
Enhancements to object-oriented property scripting (Beta)
HFSS
Performance improvements:
- Improved iterative solver
- Improved performance for designs with many sources
- Ability to disable saving adaptive pass refinement files
Improvements for SBR+ designs:
Ability to visualize link source geometry in the target design
Support for composite sources
Features for automotive radar:
- Parametric antenna arrays
- FMCW in Range-Doppler solutions
Enhancements to near field excitations and post-processing
linked antenna array source blockage in hybrid simulations
FEM 3D components mesh assembly (Beta)
New automatic airbox region for 3D component arrays
embedded element pattern export
Single-sided shell element field plotting
Azimuth elevation and slant angles for far fields
Finite Array Toolkit enhancements for amplitude tapering and sub-arrays
Support for dispersive ports in the hybrid transient solver
Option to prevent mesh-method fallback
Option to suppress gamma Zo in automatic S Parameter export
HFSS 3D Layout
Performance improvements:
- Improved iterative solver
- Improved performance for designs with many ports
- Ability to disable saving adaptive pass refinement files
Support for encrypted 3D components
Q3D DC point for designs with 3D components
FEM 3D components mesh assembly
Improved dialog box for wirebond creation and editing
Improvements to IC-mode meshing
Support for package definitions and IDF
Support for unencrypted iRCX technology in GDS import
SIwave
- Support for Granta material libraries
- Improved SYZ solver performance for designs with a very large number of ports
- New time-domain crosstalk scan for differential nets
- New integrated DDR wizard (Beta)
- Improved robustness of RLCG extraction
- Improved handling of CPM and Voltus models
- Option to visualize direction of incident waves
- Ability to specify location of capacitor and IBIS library directories
- Ability to run Icepak simulations from the Electronics installation
Maxwell
- Commercial release of new A-Phi transient solver
- Commercial release of partial mesh and solution from full rotational model
- Support for temperature-dependent core loss curves
- Support for spatially-varying materials characteristics and temperatures from XYZ datasets
- Extension of Litz wire modeling to RL matrix solutions
- Ability to create field plots of average loss
- Ability to parameterize adaptive frequency in eddy current solutions
- Enhancements to electric machine toolkit workflows and performance
- Ability to output transient electromagnetic forces to motion
- Support for element-based volumetric harmonic force in eddy-current solutions
- Support for GPU acceleration in 3D real matrix solutions
- Ability to specify minimum and maximum nonlinear iterations
- Support for time-dependent excitations and motion in system coupling
- New 3D AC conduction solver (Beta)
Motor-CAD
- Export Maxwell (2D/3D) custom DXF geometry
- Using Maxwell User-Defined Primitive for hairpin coil definition with parametrized elements
- Optimization ratio-based geometry
- Force analysis improvements
- Use Maxwell solver as an electromagnetic option for driving cycle analysis
- Thermal end-winding modeling improvement
Icepak
- New ability to generate LTI ROM models in Twin Builder
- New flow links and improved workflows for network schematics
- Improved meshing automation and workflows
- Enhancements to concurrent meshing of regions
- Ability to import IDF data through PCB components
- New fast Optimetrics option to copy meshes and solver inputs
- Ability to scale EM losses
- Ability to include dielectric loss in links from 3D Layout
- New ability to export solver monitor and residual data
- New dynamic thermal managements control (Beta)
Mechanical
- First commercial release in Electronics Desktop
- Fully integrated workflows and solutions on Windows and Linux
- Ability to set up and solve thermal and modal simulations
- EM loss coupling with HFSS Maxwell and Q3D Extractor
- Rotating fluid boundary for electric machines
- Ability to link with heat transfer coefficient calculated in Icepak
Q3D Extractor
- Commercial release of Ansys PRIME mesh option for CG solver
- Improved performance of CG direct solver
- New uniform current circuit terminals for the AC-RL solver (Beta)
Circuit
- Integration of Power Module Characterization Tool in Circuit designs
- Enhanced efficiency of dynamic links to field solvers
- AMI model support for single-ended devices
- Addition of parasitic elements to L and C models
- New support for eye measurements in countour plots
- Integration of SPISim SPro functionality into Network Data Explorer
- Addition of Nexxim as default simulator for SPISim
- New SPISim COM capabilities including PowerSum Effective Return Loss (ERL)
- Improved DC passivity preservation in state-space fitting (Beta)
EMIT
- First commercial release in Electronics Desktop
- Improved coupling link with HFSS and HFSS 3D Layout
- Enhancements to workflows and usability of schematic editor
- Improved automation and scripting API
- Support for import of projects from classic EMIT
Twin Builder
Modelica Workflow Enhancements
- Support for Modelica package creation and library management
- Support to extend existing Modelica model
- Enhanced support for graphical annotation
- Faster loading of Modelica libraries and numerous other Modelica usability enhancements
Enhancements to ROMs and ROM Viewer
- Support for Fields Visualization in Dynamic ROM Builder
- Static ROM Builder supports geometrical parameter variation
- New Response Surface ROM Toolkit
- UI for Linear Parameter Varying (LPV) ROM
- Enhancements to the Static ROM Viewer
- Support for 3D Visualization during Simulation inside Twin Builder
Battery and EV Verticalization
- Toolkit to perform Failure Mode & Effect Analysis (FMEA)
- Motor Equivalent Circuit Toolkit for FMU export
- Battery Wizard improvement
- New EV Powertrain Library
- Toshiba component library as ACT extension
Export Deployment and Digital Twins
- Support for Schematic authoring Python block and simulation result explorer in Twin Deployer
- Export Twin project for sample deployment and DTDL for Microsoft Azure Digital Twin deployment
- Enhanced interoperability with all-inclusive Tool-coupling FMU
- Support for FMU (fixed step) export from Simulink for Twin Builder
- Improved compilation of FMUs and Twin Builder Fluent component on Linux
- Improved UI for adaptor for flsim in Fluent
Support for Enterprise Workflow
- Ansys Minerva integration in Twin Builder
- Ansys optiSLang integration in Twin Builder
General
- Numerous Useability and Performance Enhancements
Selected Defect Corrections
Electronics Desktop
- 269988 Root cause of the bug was the user using a model exported by SIwave many releases ago. SIwave model export has improved significantly and users will benefit from updating the suite of models they have exported from SIwave
HFSS 3D Layout
- 326179 layer Stackup Wizard etching orientation support improvements
HFSS
- 285481 Active S-parameters are now reported correctly for 3D Component arrays with passive cells
- 292616 User now gets warning that only real part of the conductivity and permeability is used for a non-solve-inside object
- 302856 Project with SpaceClaim link now can be archived even if SpaceClaim installation is present
- 311009 Near field result is now correct when placing an analytical incident wave source inside solution region
- 314783 Fixed observed crashes for encrypted components with labels on Linux
Icepak
- 189896 HFSS Feedback in Icepak now provides accurate temperatures
- 224219 Fields Calculator now has an option to select both default and adjacent sides of a surface
- 278969 Time varying temperature boundary condition for a source BC now works correctly
- 297528 Primitive shape identification in Icepak for some inclined rectangles now works correctly
- 301201 Cell layers at the interface are now included for mesh import in AEDT Icepak
Maxwell
- 280848 Auto HPC setting now allows any combinations of cores number and variations number
- 285823 DDM in magnetostatic solver is now able to support value boundary
- 298440 Fixed incorrect full model plots for 3D designs with odd symmetry boundary condition
- 298447 An excitation can now be defined on a conductor face touching other conducting bodies in 3D electrostatic solver
- 302856 Project with SpaceClaim 📁 文件列表/
├─📁 ANSYS Electronics Suite 2021 R1 x64/
│ ├─📄 Ansys.Electronics.2021.R1.Win64.iso
│ └─📄 Ansys.Electronics.MCAD.Translators.2021.R1.iso
└─📄 Crack.zip